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Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or the granting authority. Neither the European Union nor the granting authority can be held responsible for them.

ACKNOWLEDGMENT: ARCHIMEDES is supported by the Chips Joint Undertaking and its members, including the top-up funding by National Authorities  under Grant Agreement No 101112295.

© 2024 by ARCHIMEDES Consortium.

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ARCHIMEDES at ESREF 2024 in Parma

Benewende-Diane Bonkoungou from CEA-Leti presented ARCHIMEDES poster during the 35th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis ESREF2024 in Parma, Italy.

 

Organised by Universita di Parma, ESREF 2024, the 35th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis took place from September 23 to 26, 2024.


This International Symposium continue its 35-year history of focusing on the latest research developments and future directions in failure analysis, quality, and reliability of materials, devices, and circuits for microelectronics and optoelectronics, power, space, and automotive electronics. It historically provides a European forum to develop all aspects of reliability, including management and advanced failure analysis techniques for present and emerging semiconductor applications. 

 

More information here: https://www.esref2024.org/



ARCHIMEDES at ESREF 2024 in Parma

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